sooo. i was thinking, why sony didn't soldered directly, or used an long life thermal epoxy instead of thermal paste..
from what it seems, sony didn't tested enough the ps3 cooling capabilities, and so decided to use crappy thermal paste instead...
i was thinking that if sony decided to directly solder the die to the ihs, the cooling capabilities whould degrade a lot less in the time, and maybe the cases of ylod or failed nec tokins whould be a lot less important...
what do you guys think?
from what it seems, sony didn't tested enough the ps3 cooling capabilities, and so decided to use crappy thermal paste instead...
i was thinking that if sony decided to directly solder the die to the ihs, the cooling capabilities whould degrade a lot less in the time, and maybe the cases of ylod or failed nec tokins whould be a lot less important...
what do you guys think?